ASPEED AST2100 System Level Test Driver
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ASPEED AST2100 System Level Test Driver
Ed Sperling The push toward more complex integration in chips, advanced packaging, and the use of those chips for new applications is turning the test world upside down. Most ASPEED AST2100 System Level Test think of test as a single operation that is performed during manufacturing. In reality it is a portfolio of separate operations, and the number of tests required is growing as designs become more heterogeneous and as they are used ASPEED AST2100 System Level Test markets such as automotive and industrial markets where chips are expected to last 10 to 20 years.
In fact, testing is being pushed much further forward into the design cycle so that test strategies can be defined early and built into the flow. Testing also is becoming an integral part of post-manufacturing analysis as a way of improving yield and reliability, not just in the chip, but across an entire system in which that chip and other chips are being used. The problem is that not all of the results are consistent, which is why there is a growing focus on testing at a system level.
You need to put it right in the middle of a hotspot. The challenge is understanding where that is because hotspots found during ATE are different than the hotspots found during a traffic test.
Semiconductor Engineering Toward System-Level Test
The good is this is all in-house. The bad is this is a big transition. It needs to flow from the chip to SMT to board test to system test. Chipmakers and OSATs traditionally have used a fixed percentage of their total operating budget for test.
But test is getting more complex alongside chips. ATE is predictably deterministic. A comparison of two test approaches. That is beginning to change, and along with that the definition is beginning to evolve. Part of the reason is the growing role that semiconductors are playing in various safety-critical markets, such as automotive, industrial and medical.
This requires much more up-front planning, however. Rather than waiting until a chip gets into manufacturing, the strategy for what gets tested, when it gets tested, and how it will be tested need to be well thought out at the beginning of the chip design process.
As a result, test and packaging discussions happened much later in the design flow. At the early behavioral level, which is an abstract algorithmic model, there is no implementation detail.
Then it goes to a manufacturing production line where you test each one. The goal there is to get it through the tester as fast as possible. Speed is essential on the manufacturing and packaging side, and there are ASPEED AST2100 System Level Test distinct approaches emerging to limit the time it takes to do system-level test and thereby minimize the cost.
One involves testing more ASPEED AST2100 System Level Test more quickly using existing equipment, which is where Advantest is heading. Then, if it looks like there is a bigger opportunity in the market, we take it commercial. Astronics Speed of test in manufacturing is particularly important for complex SoCs at advanced nodes as well as in packaging, because there are multiple chips to test.
Toward System-Level Test
From the outside, a system-in-package SiP looks the same to a tester. But there is more to test, and access to some of those components may be limited. Every die in a package may be operating at the corner of the spec, so all of your performance budget gets eaten up. Or ASPEED AST2100 System Level Test an assembly point of view, you are dealing with vias, traces on the substrate and bumping, ASPEED AST2100 System Level Test are all grouped under connectivity.
On top of that, the test area is in the center of the wafer and the die area is around the test pattern. A third approach uses big data techniques to improve coverage, regardless of which equipment is employed, by pinpointing where problems occur during and after manufacturing. If you have a fixed test budget and you can excuse some devices from that level of testing, you can apply those resources to more exhaustive testing where it is needed.
That allows companies to trace back problems to the root cause, which may ASPEED AST2100 System Level Test as detailed as the day and time it was manufactured, when it was put on a tester, or the origin of a particular lot of chips. The goal here is to identify the aberrations in a data plot, and to find patterns that are not visible with individual tests.
With shared data, you can correlate everything and figure out only 10 tests are relevant to a PCB failure, so you can relax the others. In some cases, yield will increase for zero difference in cost. In others, yield may drop initially, but there are still more products to sell because you know what to look for. In the future, suppliers might have to use machine learning for this.